 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR Light Emitting Diode I MODELNo. LTlS9OA 1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment 1 L * Tooling machines * Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train automobile etc.) * Rescue and security equipment * Traflic signals * Gas leakage sensor breakers * Other safety equipment I i (3) Please do not use this product for equipment which require extremely high reliability and safety in timction and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) i * Nuclear power control equipment * Medical equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED BY: M.Katoh, Department General Manager of Engineering Dept.,III Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION CUSTOMERS DATE: APPROVAL BY: Jad19lOO LTlSSOA Sriecification 1. Application This specification applies to the light emitting diode device Model No. LT 1 S 90A. [GaAsp/GaP(orange)chip LED device] 2. Outline dimensions and terminal connections . . . . . . . ..***.*.........Refer to the attached sheet Page 2. 3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-5. 3- 1. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6. 4- 1. Test items and test conditions 4-2. Failure judgement criteria 5. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7. 5-l. Inspection method 5-2. Description of inspection and criteria 6. Taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 8- 10. 6-1. Taping 6-2. Packing specification 6-3. Label 6-4. Luminous intensity rank 7. Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page' 11. 7- 1. Reflow soldering 8. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 12. 8-1. Precautions matters for designing circuit 8-2. Cleaning method 9 Env~o~ent.......................................~.............Referto~ea~chedsheetP~e 12. 9-1. Ozonosphere destructive chemicals. 9-2. Bromic non-burning materials 2. Outline dimensi&s and terminal coMections - I( 3. 6 Cathode mark(blackl . Terminal 0 connection Anod: Qc unit mm PWB: Resin: Material Glass-Epoxy Epoxy athode Finish Au Plated Drawing No. 51201002 3. Ratings and characteristics 3- 1. Absolute maximum ratings Parameter Symbol [Power dissipation P IF Rating (Ta=2S'C) Unit mW mA mA n-A/T V 85 ~ OC 100 1 "C 1T 1 I 84 30 VR Topr Storage temperature Tstg 1 ISoldering temperature(Note 2) 1 Tsol 1 (Notel) Duty ratio=l/lO,Pulse width=O. lms (Note2) Manual soldering Max.3~ -25 -25 260 (Note 3)Measured by SHARP EG&G MODEL5SO(Radiometer/Photometersyste (Tolerance : f 15%) 3-3. Derating Curve Forward Current Derating Cunz 60 $ ic E g a $ g $ 60 i z ii 5 -g z g 50 40 30 20 10 50 40 30 20 10 0 -25 0 25 50 $5100 125 0 25 50 75*5100 125 Ambient Temperahue Ta("C) Ambient Temperature Ta("c) Peak Forward Current vs. Duty Ratio (Ta=25"C) l/100 l/10 1 10 I Duty Raito Jan/19/00 PAGE 5112 3-4. Characteristics Diagram(typ) (Note -Forward Current vs.Forward Voltage Ua=25W Relative Luminous Intensity vs. Ambient Temperature (IF=2OmA~ i k'i i i ii / i I t 1 i1111i i i iii II II! I I I I I III !I !I !I !II i !I !I I I ' ' ' `1' ' ' ' ' ' ' ' 1.2 1.4 1.6 1.8 2 2.2 2.4 i i i 1! //I I -60 -40 -20 0 20 40 60 80 100 120 1 Forward Voltage VFW) Ambient Temprature Ta("C) Rda!ive Lmincxs Iriiemity vs. Forward Cm (Ta=25"C) 1000% 9 @ P % 2 5 s .-8 3E P .e t 72 e?, lOO!A 10% 1% 0. 1 1 10 100 Forward Current IF(m4) (Note 1) Above characteristic data are typical data and not a guarantteed data. 4. Reliability The reliability of products shall be satisfied with items listed below. 4-1. Test items and test Test items temperature cycling High temp. and high humidity storage conditions Test conditions -25"c(3Omin)-+1OO"c(3Omin),3Otimes Ta=+6O"C, 9O%RH, t-500h Confidence level: 90% Samples (xl) LTPD Defective (C) (%) n=22, c=o n=22, C=O n=22, C=O n=22, C=O n=22, C=O n=ll, C=O n=ll, C=O n=ll, C=O 10 10 10 10 10 20 20 20 High temperature storage Ta=lOO"C,e500h Low temperature storage Ta=25"C,r500h Operating test Mechanical shock Variable frequency vibration Soldering heat Ta=25"c,IF=30mA,t-5OOh 15 ooods2, 0.5ms, 3times I *X,+Y,+Z direction 200m/s2, 100-2 000-l OOHz/sweepfor 4min. , 4timesbX+Y,*Z direction Refer to the attached sheet, Page 1l/12 ltimes 4-2. Failme judgement criteria * 1 Parameter Forward voltage Reverse current Luminous intensity SplbOl VF IR Failure judgement criteria *2 v, > U.S.L. x 1.2 IR > U.S.L. ' 2.0 The fkst stage value X 0.5 > Iv Iv * 1: Measuring condition is in accordance with specification. *2: U.S.L. is shown by Upper Specification Limit. Jan/19/00 5. Incominginspection 5-1. Inspection method A singlesampling plan, normalinspectionlevel S-4based IS0 2859-l shallbe adopted. on 5-2. Descriptionof inspection criteria and FIO. Inspectionitems Radiationcolor Taping Solderability 1 Electra-optical characteristics Outline dimensions Appearance Criteria Not correct Product inserted reversedirection in Plating abnormality observedover 50% or greaterpercentage 1 * Not conformingto the specification. Not conforming the specification to Dust : @ 0.8mmor more Defect AW 1 2 3 4 5 6 Major defect 0.1% Thread dust : 2.5mmor morein lengthand0.25mmor morein width Air bubbles $0.8mm or more : Scratch: 2.5mmor morein lengthand0.25mmor morein width However&e product is qualifiedasa goodunit if the scrachdoesnot touch the Auwire.whenseent?omthe tiont. Resinbarr : Over the unspecified tolerance Resinond platedcrack :0.3mmor more could solder50% or greaterandlessthan 90% out of judgemem area* 1 * 1 Judgement : The plated areaof the product bottom area 7 Solderability2 Minor defect 0.4% I.._ i-. . DG-001020 Jad19lOO 6.Taping specification 6- 1.Taping 6-1-l.Shape and dimension of tape(TYP.) oncay square enson exe 6-l-2.Shape and dimension of reel(TYP.) DG-001020 1 Jan/19/00 1 PAGE I 6-l-3.TaDinr! SDecification (1) Lead-tap;: a End 000000 Beginning 40-50 pitch (2) Cover tapestrengthagainstpeeling:F=O. l--O.SN(0 =IO"or less) Cover 1 ' `yape speed : ~DIIU/S (3) Tape strengthagainst bending: The radiusof bendingcircle shouldbe 3Omm more. or If it is lessthan 3Omm, cover may peel. the Thereshouldnot bejoint of cover tapeor carrier tape. (4) Jointing of tape: Average3,OOOpcs. reel per (5) Quantity per reel: Average0.02gI product (6) Massper product: Average 15Og packing I (7)Massper packing: @ There should be missing not abovecontinuous three products. (8) Others: @ Productsshouldbe easilytakenout. @ Productsshouldnot be attached the cover tapeat peeling. to 6-2. Packingspecification 6-2-l. Dampproofpackage In other to avoid the absorption humidity in transportandstorage, the productsare packed of in aluminumsleeve. Label b Silicagel Q Ree1 Label __ 6-2-2.Strageconditions Temperature: 5 to 30C Humidity : less than6O%RH 6-2-3.Treatmentafter opening (1) Please makea solderingwithin 15 daysafter opening under following condition; Humidity : less than6O%RH Temperature: 5 to 30C (2) In casethe devicesarenot usedfor a long timeafler opening,the storage dry box is recommendable. in Or it is better to repackthe deviceswith a desiccative the sealerandput them in the somestorage by conditionsas6-2-2. Then they shouldbe used within 15days. (3) Please makea solderingafter a following bakingtreatmentif unused term shouldbe over the conditionsof (2) *Recommendable conditions: 0 in taping Temprature:60"C 65"C,Time:36to 48hours to 0 in individual (on PWB or metallictray) Temprature:100"Cto120C ,Time:2 to 3 hours 6-3. Label SHARP CORPORATION PART No. QUANTITY LTlS9OA + Model number 3000 + Quantity ofproducts ...-j - EIAJ C-3 Bar code lm..w".- (Notel)Lot numberindication clclcloclclclcl--__ a 0 000 0 Productionplant code(tobe indicatedalphabetically) @ Productionlot(singleor doublefigures) @ Year of production(thelasttwo figuresof theyear) @ Month of production (to be indicatedalphabeticallywith January corresponding A) to @ Dateof production(0 l-3 1) 64Luminous intensityrank (Note2)(Note3) Rank C D E F G' Luminousintensity 4.7 12.9 Unit (Ta=25"c) Condition 9.6 13.9 20.0 28.8 - 18.6 26.9 38.8 (56.0) mcd Ir=2omA (Tolerance: zk 15%) (Note 2) Not askthe delivery ratio of each rank. (Note 3) In case the distributionof the luminous of intensity shift to high, at that point new upperrank is prescribed lower rank is delete. and 7. Soldering 7-1 .Reflow soldering (1) It is not recommended to exceed the `soldering temperature and time shown below. Caused by substrate bend or the other mecha&al stress during reflow soldering may happen Au wire disconnection etc. Thnefore please check and study your solder reflow machine's best condition. (2) Reflow soldering temperature protile to be done under the following condition. MAX 250 140-160 Time(s) Recommendable Thermal Model (3) Recommendable Metal Mask pattern for screen print Recommend OSmm to 0.7mm thickness metal mask for screen print. Caused by solder reflow condition, solder paste, substrate and the other material etc., may change solderability. Please check and study actual solderability before Center cd the product -. -. I / %L 1.75 J= 2 - Recommended soldar pattern (U&mm) 8. Precautions for use 8- 1. Precautions matters for designing circuit This product is not designed as electromagnetic and ionized-particle radiation resistant. 8-2. Cleaning method Please use only the foIlowing types of solvent."water" Recommend conditions: RT. 4OlrHz, 3OWA, time is less than 3 minutes Please check the effect on the product from ultrasonic bath, ultrasonic output, duration, board size method. and product mounting Please test the cleaning method under actual conditions and check for abnormalities before actual use. 9. Environment 9-l. Ozonosphere destructive chemicals. (1) The product doesn't corttain following substance. (2) The product doesn't have a production line whose process requires following substance. Restricted part: CFCs,halones,CCl.+Trichloroethaue(Methychlorofonn) 9-2. Bromic non-burning materials The product doesn't contain bromic non-burning materials(PBBOs,PBBs) LT1S90A, surface mount, sunset orange, 3 mm x 3 mm, 610 nm, chip LED |
Price & Availability of LT1S90A
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |